PROCESS FOR ETCHING A SILICON WAFER

摘要

A process for etching a silicon wafer is disclosed in which the oxidizing agent of the aqueous etching solution is reconditioned or regenerated by re-oxidation, rather than simply adding fresh reagent. The present process affords the means by which to more consistently obtain a silicon wafer having improved gloss or smoothness, while minimizing the amount of silicon removed from the wafer surface.