| 摘要 |
PURPOSE: An apparatus and a method for lifting multiple wafer are provided to increase throughput by increasing the number of substrates that can be simultaneously held within a cell so the substrates can be swapped. CONSTITUTION: A cluster tool(100) comprises two process cells(106,108), a transfer cell(116), a load lock cell(120), a substrate handling portion(160), and a metrology cell(168). Each process cell(106,108) may be used in one or more distinct types, stages, or phases of semiconductor substrate processing. Each process cell(106,108) comprises a first substrate lift(206) and a second substrate lift(208). The substrate handling portion(160) comprises a handling platform(162), an atmospheric robot(164), a substrate loading pod(166), and a metrology cell(168). In the substrate handling portion(160), the atmospheric robot(164) transfers substrates under the control of controller(136) between the handling platform(162), the substrate loading pod(166), the metrology cell(168), and the load lock(120).
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