| 摘要 |
A layout for a ball grid array (BGA) device (500) includes a set of solder ball pads (512) and a set of interconnection vias (510). Each one of said the set of interconnection vias (510) is coupled to a corresponding one of the solder ball pads (512). The interconnection vias (510) are laid out such that they provide for increased room for both vertical and horizontal traces (602, 702 and 802). With the BGA device (500) divided by an X-axis and a Y-axis to form four quadrants, two other axes V and W, are established rotated 45 degrees from the X and Y axes respectively. The solder pads (512) and interconnection vias (510) are on laid out on lines along or parallel to the V and W axes. The interconnection vias (510) in the four quadrants are located closer to the edge margins of the BGA device (500) than their corresponding solder ball pads (512).
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