发明名称 CUTTING AND SECONDARY WORKING FACILITY
摘要 PROBLEM TO BE SOLVED: To automatically carry the cut bar-like material to a secondary working device 2 for setting in a facility provided with a cutting device 1 for cutting a bar-like material into a dimension and a secondary working device for chamfering both ends of the cut bar-like material. SOLUTION: A first carrying means 4 for carrying a bar-like material W from a cutting device 1 to a secondary working device 2 and a second carrying means 6 formed of an articulated robot or the like are provided. The first carrying means 4 holds a part of the bar-like material M to be cut by the cutting device 1 for separation with a peripheral pinching clamp 22 so as to carry the separated bar-like material M to a delivery position PR with the peripheral pinching clamp 22. The second carrying means 6 holds the bar-like material W held by the peripheral pinching clamp 22 of the first carrying means 4 at the delivery position PR with an axial direction pinching clamp 36 so as to receive the bar-like material W from the first carrying means 4, and carries the bar-like material W to a holding position for holding the bar-like material W with a peripheral pinching clamp 7 of the secondary working device 2.
申请公布号 JP2002113632(A) 申请公布日期 2002.04.16
申请号 JP20000309056 申请日期 2000.10.10
申请人 TSUNE SEIKI CO LTD 发明人 TSUNE YOSHITAKA
分类号 B26D7/18;B23D47/04;B23Q7/04;B23Q7/14;(IPC1-7):B23Q7/14 主分类号 B26D7/18
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