| 发明名称 |
CURABLE RESIN COMPOSITION AND MOLDING MATERIAL, ETC., CONTAINING THE COMPOSITION |
| 摘要 |
PROBLEM TO BE SOLVED: To suppress the odor of styrene monomer and methyl methacrylate in an unsaturated resin composition. SOLUTION: The curable resin composition contains (A) a resin having polymerizable unsaturated bond and (B) a polymerizable unsaturated monomer. The polymerizable unsaturated monomer B contains an alkylcyclohexyl (meth) acrylate having a 1-8C alkyl group as an essential component.
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| 申请公布号 |
JP2002114829(A) |
申请公布日期 |
2002.04.16 |
| 申请号 |
JP20000304787 |
申请日期 |
2000.10.04 |
| 申请人 |
DAINIPPON INK & CHEM INC |
发明人 |
MATSUTANI HIDEFUMI;NONAKA SHINICHI;TOMIYAMA TAKASHI;MOTOMIYA SHIGERU |
| 分类号 |
C08F290/06;C09D4/02;C09D4/06;C09D5/00;(IPC1-7):C08F290/06 |
主分类号 |
C08F290/06 |
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