| 摘要 |
A semiconductor apparatus includes a plurality of semiconductor units and a common gate liner having silicon chip resistors at portions corresponding to the semiconductor units. Each unit includes a semiconductor chip, a collector base plate fixed to the chip, an insulative positioning guide, an emitter contact terminal, and a contact probe having two distal contact ends. The positioning guide positions the emitter contact terminal on the emitter electrode and the contact probe on a gate pad. The semiconductor units are collectively held by the gate liner such that the contact probes press the respective silicon chip resistors and the respective gate pads. The individual positioning guide prevents dislocation of the contact probe and the gate pad. The semiconductor apparatus simplifies the gate wiring and improves the precise positioning of the constituent elements and the reliability of the apparatus. The package size is reduced as well.
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