发明名称 RESIN SHEET AND MOLDING FOR CONVEYING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a resin sheet having excellent mechanical properties such as a buckling strength, impact resistance, rigidity or the like and excellent printability and heat sealability and a molding for conveying an electronic component formed by using the sheet. SOLUTION: The resin sheet having a salami structure in which a dispersed state of a rubber in a rubber-reinforced styrene resin (B2) component is a matrix phase of a polystyrene resin is manufactured in the sheet having outer layers containing a polystylene resin (B1) and the rubber-reinforced styrene resin (B2) formed on both surfaces of a base layer containing a styrene-butadiene copolymer (A1) and a polystylene resin (A2). The sheet is formed to obtain the molding for conveying the electronic component.
申请公布号 JP2002113818(A) 申请公布日期 2002.04.16
申请号 JP20000308025 申请日期 2000.10.06
申请人 DAICEL CHEM IND LTD 发明人 HAYASHI JUNICHIRO
分类号 B65D73/02;B32B25/14;B32B27/00;B32B27/30;B65D85/86;C08F291/02;C08L9/06;C08L25/04;C08L51/04;C08L53/02;(IPC1-7):B32B27/00 主分类号 B65D73/02
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