| 摘要 |
<p>PURPOSE: A multi-chip package is provided to reduce size and thickness of a package by making semiconductor chips mounted in a substrate having a stepped groove, and to minimize thermal stress by performing an electrical connection through one reflow process. CONSTITUTION: A stepped groove is formed in the center of the substrate. The first and second pads are disposed on the bottom surface of the groove and the stepped surface. The first and second pads are electrically connected to the third pads(15) disposed on the lower surface through an inner circuit pattern, respectively. Bond pads(21) of an area array type are formed on the upper surface of the first semiconductor chip(30) attached to the bottom surface of the stepped groove of the substrate by using a bump as a medium. The bond pads are electrically connected to the first pads(13) of the substrate. Bond pads(31) of an edge array type are formed on the upper surface of the second semiconductor chip attached to the stepped surface of the stepped groove by using a bump as a medium. The bond pads are electrically connected to the second pads(14) of the substrate.</p> |
