Method for cutting a composite structure comprising one or more electronic compnents using a laser

摘要

A method and device for cutting a composite structure (1) comprising one or more electronic components (3), in particular integrated circuits, the method using a laser (9), wherein during the cutting of the material of the composite structure (1), a physical quantity relating to the cutting is measured and wherein the power of the laser (9) is adjusted depending on that quantity. The invention further comprises a method for testing ICs accomodated in a composite structure.