发明名称 |
METHOD AND APPARATUS FOR DOPING BY LANE IN A MULTI-LANE SHEET WAFER FURNACE |
摘要 |
A method and apparatus for forming a sheet wafer add material to a crucible having a feed area and a dump area, and melt the material to form a wafer growth are between the feed area and the dump area. The material is added to the feed area and removed through the dump area. The method and apparatus substantially simultaneously draw a plurality of sheet wafers from the growth area, and directly apply dopant to the melted material at the growth area. The dopant thus bypasses the feed area to dope at least a portion of the growth area. |
申请公布号 |
WO2013033202(A3) |
申请公布日期 |
2013.06.06 |
申请号 |
WO2012US52848 |
申请日期 |
2012.08.29 |
申请人 |
MAX ERA, INC;KERNAN, BRIAN |
发明人 |
KERNAN, BRIAN |
分类号 |
C30B11/00 |
主分类号 |
C30B11/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|