| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for preparing an IC card with a desired thickness. SOLUTION: A cooling press adjusting equipment 94 is provided. The adjusting equipment 94 allows a comparator 97 to compare a preset distance (a distance that is a clearance between an upper pinching plate 20 and a lower pinching plate 21 in a base pressure equipment 24 pinching the product section 38 of an IC card is 0.75 mm) with a clearance between actual pressure plates 31 and 32 through a setter 98 and controls a position control circuit 99 in order that an output of the comparator 97 is zero. Under these conditions, the equipment 94 may maintain a position of the plate 31 through a servo motor 30, i.e., the clearance between the plates 31 and 32 at a distance that a clearance between the plates 20 and 21 in the equipment 24 pinching the product section 38 of the IC card is a distance that is 0.75 mm, the thickness of the IC card to be manufactured. |
