| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for laminating printed boards upon another by which the connection reliability between conductive bumps and lands can be secured. SOLUTION: In the process of a heat pressurization press, the pressurization to the conductive bumps 8 is started with a pressure under which the bumps 8 can pass through adhesive layers 10 after the adhesive layers 10 are maintained at a first pressing temperature at which the layers 10 are softened to such a degree that the bumps can pass through the layers 10 for a prescribed period. Since the adhesive layers 10 start to soften at the time of performing the pressurization, the conductive bumps 8 can readily pass through the layers 10 and come into contact with lands 9A. Consequently, the connection reliability between the bumps 8 and lands 9A can be secured. In addition, the bumps 8 can be brought into contact surely with the lands 9A, because all adhesive layers 10 can be softened sufficiently even when the adhesive layer 10 is unevenly heated by holding the layer 10 at the first pressing temperature for the prescribed period of time. |
