| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring circuit board wherein unevenness is little generated on an insulating layer when the insulating layer is laminated on a conductor layer which is formed as a prescribed circuit pattern and the wiring circuit board can be formed in a thin layer. SOLUTION: First holes 4 which do not penetrate a base insulating layer 2 are formed as a prescribed circuit pattern on the base insulating layer 2, and a second hole 5 which penetrates in the thickness direction of the base insulating layer 2 is so formed that the circuit pattern has electric continuity in the lamination direction. The first holes 4 and the second hole 5 are filled with conductor, and a base side conductor layer 6 is so formed that a surface of the base insulating layer 2 and a surface of the base side conductor layer 6 form a continuous flat surface, practically. |
