| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized chip capacitor having large capacitance at a low cost. SOLUTION: The chip capacitor has a lead 1, a capacitor element 2 formed of a dielectric oxide film, a solid electrolytic layer, and a cathode lead-out layer; an electrode substrate 7 to be a capacitor electrode; and a packaging resin 2. The electrode substrate 7 is provided with an insulating layer 4 having at least two through-holes, a conductive plate 3 disposed to cover one of the through-holes, and an electrode layer 10 formed by burying the through-holes.
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