WAFER TREATMENT DEVICE AND METHOD OF DRYING WAFER

摘要

PROBLEM TO BE SOLVED: To provide a wafer treatment device with which uneven drying of a wafer hardly occurs even when clean air is applied to the wafer at a high flow rate. SOLUTION: This wafer treatment device has a spin coater, an edge rinse unit and a drying acceleration unit. The spin coater coats a wafer W with a resist. The edge rinse unit performs other treatments on the wafer W coated with the resist. The drying acceleration unit is disposed between the spin coater and the edge rinse unit and accelerates drying of the wafer W by applying clean air to the wafer W coated with the resist from upward. This drying acceleration unit has a pad 26 generally surrounding the lower and side portions of the wafer W.