| 摘要 |
PROBLEM TO BE SOLVED: To provide application device and method for securing uniformity in resist-film pressure in application treatment of resist by a nozzle with a plurality of discharge ports. SOLUTION: Resist is applied from end sections G2 and G4 of a substrate G toward a center section in the order of a discharge start point S1 to S2 (a first row), S2 to S3, S3 to S4 (a second row),..., and Sn-1 to a discharge end point Sn (an nth row), thus setting the drying time of applied rows at the end sections G2 and G4 to nearly the same. Therefore, the drying time of each applied row becomes symmetric with the applied row of a substrate center line M as a center, thus giving the treatment of a next process with the drying state, securing the uniformity in the film pressure, reducing the amount of discharge of resist liquid when the nozzle moves outside the substrate G, and saving the resist since discharge is stopped. |
