| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a chip-on-film substrate, where a copper layer can remain around sprocket holes effectively, without increasing pattern defective due to occurrence of short or the like and with little loss of material. SOLUTION: This method for manufacturing the chip-on-film substrate, where sprocket holes are formed on a tape-like two-layer base material where the copper layer is adhered directly, to a polyimide based film, and a wiring circuit pattern is then formed on the side of the copper layer through photoresist coating, drying, exposure, developing, etching, peeling of a photoresist; and removal and furthermore, as necessary, that solder resist coating, hardening, and plating have been carried out, is characterized in that the photoresist coating is carried out only to a wiring circuit pattern forming part, and after the developing, resist has been formed only to the sprocket hole part and then dried, etching in then carried out. |
