| 摘要 |
PROBLEM TO BE SOLVED: To improve yield of semiconductor device. SOLUTION: In a method for manufacturing a semiconductor device, on the principal surface of a substrate a plurality of semiconductor chips which are mounted at prescribed intervals from a first edge of the principal surface toward a second edge opposing the first edge are disposed inside a cavity, or a forming mold with the substrate. Then, a step is provided, where a resin is injected inside the cavity from the first edge toward the second edge of the principal surface on the substrate to form a resin encapsulant for encapsulating the plurality of the semiconductor chips in batch, and additionally a step is provided where a cleaning process is conducted on the principal surface of the substrate, before the step of forming the resin encapsulant. |
