MANUFACTURING METHOD OF CIRCUIT BOARD, AND INTEGRATED SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To reduce connection failure and the cost by simplifying the packaging process of components and the connection process between circuit boards when manufacturing a circuit board using a plurality of printed circuit boards. SOLUTION: A plurality of printed circuit boards 1 and 2 with different characteristics are joined on the same plane to compose an integrated substrate, and at the same time electrical connection is made to a substrate end face metal section 9 that is connected to a wiring pattern 4 at the injection end section of the printed circuit boards 1 and 2 by solder 7 or the like, thus simplifying the connection process between the circuit boards, reducing connection failure and the cost. Also, the components are simultaneously packaged on the plurality of printed circuit boards 1 and 2 in the state of the integrated substrate 10, thus rationalizing the component-packaging process and reducing the cost.