Reworkable epoxy resins suitable for electronic component encapsulation or underfilling and having lower decomposition temperatures than commercially available polyglycidyl ethers is the reaction product of an epoxidized 1-alkenyl ether or 1-cycloalkenyl ether, and a polycarboxylic acid combined with a curing agent. The reaction product is substantially free of unreacted acid or acid impurities and contains thermally labile alpha-alkoxy ester linkages which impart reworkability.
