| 摘要 |
<p>The present invention provides an electroplating system (50) for semiconductor wafers (66) including a plating chamber (52) connected by a circulating system (52, 56, 58) to a plating solution reservoir (60). The semiconductor wafer (66) is used as the cathode with an inert primary anode (64) in the plating chamber (52). A consumable remote secondary anode (75) in the plating solution reservoir (60) provides the metal ions for plating.</p> |
