| 摘要 |
A semiconductor wafer on which elements have been formed is diced and a rear surface of the semiconductor wafer is ground by a dicing before grinding method to form discrete semiconductor chips. The discrete semiconductor chips are adhered to an adhesive film and then the surface of the adhesive film is removably affixed to a dicing tape. After this, any excess portions of the adhesive film disposed between the respective semiconductor chips are removed.
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