发明名称 Circuit board for mounting bare chip
摘要 A circuit board for mounting a bare chip in the form of a flip chip is disclosed. A metallic foil for protecting circuits in a state insulated therefrom is arranged in an area where the bare chip is located. <IMAGE>
申请公布号 EP0967650(A3) 申请公布日期 2002.04.10
申请号 EP19990112134 申请日期 1999.06.23
申请人 NITTO DENKO CORPORATION 发明人 INOUE, YASUSHI;SUGIMOTO, MASAKAZU;NAGASAWA, MEGUMU;NAKAMURA, KEI
分类号 H01L23/12;H01L23/31;H01L23/498;H05K1/02;H05K3/30;H05K3/34 主分类号 H01L23/12
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