| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition providing a cured product excellent in moisture resistance and electric characteristics and a cured product thereof useful for electric and electronic material application such as laminated board and semiconductor sealing material and powder coating. SOLUTION: This epoxy resin composition consists essentially of an epoxy resin (A) represented by the general formula (1) [wherein R1 is a 7-10C alkyl group; R2 is hydrogen atom or methyl group; (n) is an integer of 0 to 10 and represents a recurring unit number] and a curing agent (B).
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