| 摘要 |
PROBLEM TO BE SOLVED: To determine the bonding strength of an electronic part bonded to a substrate by quantitatively measuring the phosphor content in nickel plating and measuring the bonding strength of a bonded part. SOLUTION: In this part bonding strength determining system for an electronic part 6 bonded to a substrate 2 having a nickel gold plating layer provided on a land 7, the part bonding strength is determined by use of a luminance inspection device 15 for determining the blackening degree of the surface of the nickel plating layer by peeling the gold layer from the nickel gold plating layer, emitting an inspection light to the nickel plating layer, and measuring the luminance of the reflected light; a phosphor detector 30 for determining the content of the phosphor contained in the nickel plating by emitting X-ray to the nickel plating layer and measuring the intensity of the reflected fluorescent X-ray; and a part bonding strength measuring device 50 having a pressing member for pressing the bonded electronic part 6, a measuring part for measuring the load value for pressing the electronic part 6 and a drive mechanism for driving the pressing member.
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