发明名称 HEAT-SENSITIVE ADHESIVE MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a heat-sensitive adhesive material capable of retaining adhesive strength in a low-temperature environment and yet not causing blocking. SOLUTION: The heat-sensitive adhesive material comprises a heat-sensitive self-adhesive layer, formed on a support, comprising a heat-sensitive adhesive mainly composed of a thermoplastic resin and a solid plasticizer, where the solid plasticizer has a double structure where one solid plasticizer having a specified melting point, which softens the thermoplastic resin when heated, is covered with another solid plasticizer having a specified melting point, which similarly softens the thermoplastic resin when heated, and the melting point of the outer solid plasticizer is higher than that of the inner solid plasticizer. In an example, 2,2'-methylene-bis-(4-methyl-6-t-butylphenol) is covered with diethyl 3,5-di-t-butyl-4-hydroxy-benzyl phosphonate to give a double-structured solid plasticizer. A dispersion of a heat-sensitive adhesive comprising the double- structured solid plasticizer and a specified latex dispersion is applied on the back surface of a one-side coated paper to give a heat-sensitive adhesive sheet.
申请公布号 JP2002105431(A) 申请公布日期 2002.04.10
申请号 JP20000303735 申请日期 2000.10.03
申请人 RICOH CO LTD 发明人 IKEDA TOSHIAKI;KUGO TOMOYUKI
分类号 C09J7/02;C09J11/06;C09J201/00;(IPC1-7):C09J201/00 主分类号 C09J7/02
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