发明名称 |
HERMETIC PACKAGE |
摘要 |
PROBLEM TO BE SOLVED: To provide a package which can be easily unsealed with relatively weak force, which can be easily checked as to whether it has been reliably sealed, and which has high moisture resistance. SOLUTION: The hermetic package comprises first and second opposite sheet walls which are heat-bonded with a hermetic storage space provided therein. The first sheet wall comprises an olefin based resin layer laminated on an internal surface side of a base layer. The second sheet wall comprises an easy-to-peel layer laminated on an olefin based resin layer laminated on an internal surface side of a base layer, wherein the easy-to-peel layer contains a modified olefin based resin comprising an olefin based resin and a vinyl monomer. The olefin based resins laminated on the internal surface sides of the respective base layers comprise a polyethylene with an average density of 0.920 to 0.970. |
申请公布号 |
JP2002104514(A) |
申请公布日期 |
2002.04.10 |
申请号 |
JP20000299887 |
申请日期 |
2000.09.29 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD;DAINIPPON PRINTING CO LTD |
发明人 |
TAKASU TAKAHIRO;NOMOTO SHINICHI;BABA HIDEYUKI;YAMADA ARATA |
分类号 |
B65D77/20;B32B15/08;B32B15/085;B32B27/00;B32B27/32;B65D81/24;B65D81/26;C23C14/14;(IPC1-7):B65D77/20 |
主分类号 |
B65D77/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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