发明名称 SEMICONDUCTOR WAFER ADSORBING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a semiconductor wafer adsorbing device capable of preventing the reduction of a function of an ejector due to the entry of liquid in advance and adsorbing a semiconductor wafer securely. SOLUTION: This adsorbing device is provided with the ejector 11 generating suction negative pressure due to the flow through of pressurized air and a negative pressure passage 14 for leading the suction negative pressure generated by the ejector 11 into an adsorption panel 5 which is an adsorption part of the semiconductor wafer. A gas-liquid separator 20 is provided in the negative pressure passage 14, and a discharge liquid passage 21 having a check valve 22 for preventing back flow is connected with the gas-liquid separator 20.</p>
申请公布号 JP2002103262(A) 申请公布日期 2002.04.09
申请号 JP20000293253 申请日期 2000.09.27
申请人 NIPPEI TOYAMA CORP 发明人 SAIDA KUNIHIRO
分类号 B25J15/06;B23Q3/08;B65D85/57;B65G49/07;H01L21/304;H01L21/677;H01L21/68;(IPC1-7):B25J15/06 主分类号 B25J15/06
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