GRINDING METHOD FOR PARTING CHIPS, AND APPARATUS THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a grinding method for parting chips by oscillating a cutting tool into the feed direction to change the width of chips generated by the grinding, and an apparatus therefor. SOLUTION: The cutting tool 3 is oscillated in its feed direction by a piezoelectric element 14 via a finely movable base 12 by a four-node link spring mechanism. If the cutting tool 3 is oscillated in its feed direction when a work to be rotated is ground by the cutting tool 3, the width of the chips generated in the grinding is changed, and the chips are easily broken from narrow parts and can be cut into pieces.