| 摘要 |
PROBLEM TO BE SOLVED: To increase the reliability of connections when an electronic component is mounted on a mother board, even if the sizes of the electronic component such as a laminate type ceramic electronic component are increased. SOLUTION: A recessed portion 17 is formed on the side of an end face 13 of an electronic component main body 12, to provide an external connection terminal electrode 14 with a side electrode portion 18, which is formed at least on an inner side face of the recessed portion 17. When the external connection terminal electrode 14 is soldered to a conductive connection land 21 on a mother board 20, a solder fillet 22 is formed inward from an inside surface 16 of the recessed portion 17.
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