发明名称 |
Porcelain composition, porcelain and method of producing the same, and wiring board and method of producing the same |
摘要 |
The porcelain of the present invention comprises 5 to 70% by weight of a non-oxide ceramic filler and 30 to 95% by weight of a borosilicate glass having a glass transition temperature of 800° C. or lower, wherein a weight loss per unit surface area of said non-oxide ceramics is not more than 0.15 g/cm2 after dipping said non-oxide ceramic having purity of not less than 96% by weight for five minutes in a glass melt obtained by melting said borosilicate glass with heating at 1200° C. Since the porcelain composition can be fired at a low temperature together with a low-resistance metal, the resulting porcelain has a high thermal conductivity, a low dielectric constant, a high heat dissipation property and a reduced apparent signal delay in a high frequency signal and is suited for use as an insulating board in a wiring board.
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申请公布号 |
US2002039645(A1) |
申请公布日期 |
2002.04.04 |
申请号 |
US20010871601 |
申请日期 |
2001.05.30 |
申请人 |
KAWAI SHINYA;IWACHI HIROMI;TERASHI YOSHITAKE |
发明人 |
KAWAI SHINYA;IWACHI HIROMI;TERASHI YOSHITAKE |
分类号 |
C04B33/26;H05K1/03;(IPC1-7):B32B3/00 |
主分类号 |
C04B33/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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