| 摘要 |
The invention concerns a sawing device comprising a wire assembly (15) supported on wire-guiding rolls (11, 12) and pressed against a workpiece to be sawn (20) fixed on a support table (21). A oscillating device (23) enables to produce a relative reciprocating movement between the workpiece to be sawn and the wire assembly (15) around an oscillation axis (A) whereof the spatial position can be adjusted and programmed so that said oscillation axis (A) is at a programmable and adjustable distance from an effective axis of rotation (28) of the oscillating device (23). In one embodiment, the oscillating device (23) comprises therefor rotating members (27), and translating members along two directions (Z and Y) contained in the cutting plane, thereby enabling to obtain very planar sawn slices with very even surface texture and improved sawing efficiency. |
