| 摘要 |
PURPOSE: A method for manufacturing a tantalum chip condenser is provided to reduce the leakage current by forming a cathode terminal and an anode terminal with a plating layer. CONSTITUTION: Connection units(32) are formed in a line between mold products(50). Both terminal units of each product(50) are impregnated into a metal coating solution(36) of a plating bath(34). The mold products(50) are impregnated into a mixing solution made of palladium(Pd) and nickel(Ni). The mold products(50) are impregnated into a mixing solution made of tin(Sn) and lead(Pb) on upper layer of nickel-plated layer. Both sides of each product(50) are connected to earth units(42,44) to connect (-) power(40) and (+) power(38). The coating solution(36) of the plating bath(34) is connected to an electrode rod(54) connected to the (+) power(38). The connection units(32) with the mold products(50) are disconnected. Terminal units(46,48) are formed on both sides of each product(50). The terminal units(46,48) of a tantalum chip condenser(30) are formed. |
