| 摘要 |
<p>An apparatus for separating a chip package from a carrier, in accordance with the present invention, includes a separation tool having a planar surface for supporting a chip package. The planar surface includes opposite ends, and first cutting edges are disposed on the opposite ends of the planar surface. A cutting plate has second cutting edges, and the cutting plate is operatively positioned for causing a shearing action between the first and second cutting edges to sever connections to the chip package when the first and second cutting edges engage to remove the chip package from the carrier.</p> |
