发明名称 MOULDING SYSTEM
摘要 A method of and apparatus for moulding using a die (10) having a face (15) formed with at least one moulding cavity (12) therein including the steps of filling the mould cavity to excess with a desired moulding material (42), placing a backing sheet (20) over the face of the mould and pressing the backing sheet and mould against each other to compact and shape the mould material by moving the die and backing sheet at least once between two spaced, substantially parallel roller (26, 28). Excess mould material is removed by slicing across the face of the die prior to removing a moulding from the die.
申请公布号 WO0226455(A2) 申请公布日期 2002.04.04
申请号 WO2001ZA00127 申请日期 2001.08.29
申请人 STEINHOFF MANUFACTURING (PTY) LTD.;LIPMAN, BARRY 发明人 LIPMAN, BARRY
分类号 B27N3/00;B27N3/28;B27N5/00;B27N7/00;B29C43/36;B30B3/04 主分类号 B27N3/00
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