| 摘要 |
PURPOSE: Provided are an epoxy resin composition for sealing a semiconductor, which shows excellent flame-retardancy, humidity resistance, formability, and electric property without containing bromine compound and antimony oxide, and a semiconductor device using the epoxy resin composition. CONSTITUTION: The epoxy resin composition comprises (a) an epoxy resin, (b) a phenol resin, (c) a hardener, (d) an inorganic filler, and (e) a red phosphorus-based flame retardant. The red phosphorus-based flame retardant is one having 2000 ppm or less of the sum of phosphoric acid ion and phosphorous acid ion which are eluted, when extracted with water at 80deg.C for 20 hours. The red phophorus-based flame retardant comprises 20-40 wt.% of red phosphorus. The epoxy resin composition comprises 0.5-5 wt.% of the red phosphorus-based flame retardant. |
