SUPPORT APPARATUS FOR PRE-PLATED LEAD FRAME

摘要

PURPOSE: A support apparatus for pre-plated lead frame is provided to prevent the generation of a scratch of a pre-plated lead frame generated from an assembling process of a semiconductor package. CONSTITUTION: A plurality of support plates(20) are fixed to one fixing plate(10). A lead frame(30) is located on an upper surface of the support plates(20). The fixing plate(10) is fixed to a particular position of a die bonder. The support plates(20) are adhered to or separated from the fixing plate(10). The lead frame(30) is supplied to the upper surface of the support plates(20) according to a predetermined period. A multitude of unit die is located and adhered on a die adhesion portion(32) of the lead frame(30) by a pressure when the lead frame(30) is located on a proper position of the support plates(20).