| 发明名称 |
Cooling body, especially for cooling electronic components |
| 摘要 |
The invention relates to a cooling body for cooling electronic components in particular. Said cooling body consists of several elements which are soldered with tin, similar alloys or tin/powder mixtures. |
| 申请公布号 |
AU1380002(A) |
申请公布日期 |
2002.04.02 |
| 申请号 |
AU20020013800 |
申请日期 |
2001.09.18 |
| 申请人 |
BOSTON COOLTEC CORPORATION |
发明人 |
FRANK BAXMANN |
| 分类号 |
F28F13/18;H01L21/48;H01L23/367;H05K7/20 |
主分类号 |
F28F13/18 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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