| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing hemispherical silica fine particles suitable for an abrasive or the like to be used for mirror polishing of a semiconductor board such as a silicon wafer, a board for a memory hard disk or the like, and the hemispherical silica fine particles for the above use. SOLUTION: The method by which spherical polyorganosiloxane particles of 1-20μm average diameter are thermally decomposed and oxidized to be divided into hemispheres by baking in the presence of oxygen at a temperature higher than the decomposition temperature of organic groups therein. The hemispherical silica fine particles of 1-18μm average diameter and 0.1-5 m2/g specific surface area for nitrogen adsorption, formed by dividing spherical polyorganosiloxane particles around at their centers by baking the above particles.
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