发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To reduce facility costs in processing, in a tape transport system. SOLUTION: The tape section of an endless; flexible tape is passed successively and moved along at least one machining station; at the same time, a stripe body (stripe-like tape) having a processing section requiring processing is mounted to the tap before reaching a first machining station; then is made to the treatment machining section at each machining station; and the stripe body is removed from the tape that has passed the final machining station. A liquid-like object is deposited on the processing section by potting at one of the machining stations, and the liquid-like object is baked for curing at the succeeding machining stations. A locking section, that is freely detachable from the tape, or the tape and the stripe body is provided, and is operated for attaching or detaching the stripe body to or from the tape.</p>
申请公布号 JP2002093829(A) 申请公布日期 2002.03.29
申请号 JP20000284653 申请日期 2000.09.20
申请人 HITACHI LTD;AKITA ELECTRONICS CO LTD 发明人 SATO TSUKASA;ONODERA TADASHI
分类号 H01L21/60;H01L21/50;H01L21/56;(IPC1-7):H01L21/56 主分类号 H01L21/60
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