| 摘要 |
PROBLEM TO BE SOLVED: To provide a new lead frame for BCC capable of improving the adhesion of a recessed electrode pad inner surface and sealing resin. SOLUTION: In this lead frame for the BCC composed by providing a recessed electrode pad on the surface, the recessed electrode pad is provided with at least a palladium layer and a nickel layer, the palladium layer is provided on the inner surface side of the recessed electrode pad, and the nickel layer is provided more on the outer surface side than the palladium layer. Also, the crystal structure of the nickel layer and a palladium plating layer more on the inner surface side than the nickel layer is turned to a columnar structure. |
