发明名称 COMPONENT-MOUNTING APPARATUS AND COMPONENT DELIVERY METHOD USED THEREIN
摘要 PROBLEM TO BE SOLVED: To provide a component-packaging device which can reduce the load of recovering and improving availability by effectively reducing the occurrence of an adsorbing error, when an electronic component is delivered between a plurality of suction holding mechanisms. SOLUTION: An electronic component 42, which is held by a punch 12a through vacuum suction, and a nozzle 15 are brought into contact with each other under the control of a controller 39. In this state, suction of the electronic component 42 is determined on the nozzle 15, based on the detection result of a suction sensor 38 on the receiving side. When it is determined that the electronic component 42 has been sucked, vacuum suction of the punch is removed and a prescribed normal completion process is conducted. When it is determined that the electronic component 42 has not been sucked, vacuum suction of the punch 12a is removed, and the detection result of a suction sensor 35 is re-determined, without immediately having to conduct abnormal completion process. Even if determination is conducted again, if it is determined that the electronic component 42 has not been sucked, a prescribed processing on abnormality completion is conducted.
申请公布号 JP2002093859(A) 申请公布日期 2002.03.29
申请号 JP20000281637 申请日期 2000.09.18
申请人 SHIBAURA MECHATRONICS CORP 发明人 UEDA SHUNICHI
分类号 G02F1/13;B25J13/00;B25J15/06;H01L21/60;(IPC1-7):H01L21/60 主分类号 G02F1/13
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