| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC module with excellent durability and reliability and to provide a method for inexpensively and efficiently manufacturing the IC module. SOLUTION: This IC module is formed of an IC chip 1, a bump 4 formed on the input and output terminal of the IC chip 1, and a winding coil 5 directly connected to the bump 4. The winding coil 5 is formed of a covered conductor consisting of a copper wire 5a covered with an insulating film 5b, and the end of the winding coil 5 are directly connected to the bump 4 so that the central line X-X of the copper wire 5a is arranged within the opening width W of the input and output terminal 2. As the direct connecting means of the copper wire 5a to the bump 4, welding or wedge bonding can be used. |
