SOLDERING METHOD FOR CONDENSER MICROPHONE USING SMD TYPE

摘要

PURPOSE: A soldering method for a condenser microphone using an SMD(Surface Mounting Device) type is provided to minimize the degradation of the sensibility characteristic of the condenser microphone by decreasing the quality of heat supplied to the condenser microphone when a soldering work is performed using the SMD type. CONSTITUTION: A condenser microphone is dried at 100-110°C temperatures during 4 hours. A solder cream is partially covered on a PCB(6) of a product for soldering the condenser microphone(1) to correspond to 3 or 4 points between a plus(+) terminal of a bottom center of the dried condenser microphone(1) and a minus(-) terminal formed in a circumference of the dried condenser microphone(1). The condenser microphone(1) is safely received on the PCB(6) of the product on which the solder cream is covered, and heat with 230-250°C is applied during 3-5 minutes for connecting the condenser microphone(1) to the PCB(6) of the product.