| 摘要 |
PROBLEM TO BE SOLVED: To provide an internal layer substrate which is suitable for a build-up multilayer circuit board and has a spacer on an internal layer circuit board, a multilayer circuit board which has an electrical insulation layer having a uniform thickness on the internal layer substrate and a method for manufacturing them. SOLUTION: The internal layer circuit board is composed of an internal layer circuit board comprising an electrical insulation layer (1) and a conductor circuit (1) formed on its surface, an internal layer board which has a spacer formed or placed with an almost uniform thickness in a specified position of the internal layer circuit board, a multilayer circuit board which has an electrical insulation layer (2) formed with an almost equal thickness to the spacer on the internal layer board, an electrical insulation layer (1) and a conductor circuit (1) formed on its surface. The method for manufacturing a multilayer circuit board has a step of forming or placing a spacer with an almost uniform thickness in a specified position of the internal layer circuit board and a step of forming an electrical insulation layer (2) with an almost equal thickness to the spacer. |
