| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, where its characteristics are conformed by a check element provided within a semiconductor chip to prevent leakage of design secrecy of an internal circuit after shipping of an LSI, and which can solve all the problems, including reduction in durability of a blade at dicing of a semiconductor wafer, influences due to the internal circuit at measuring of the characteristics, and short-circuiting after the dicing. SOLUTION: The semiconductor device has a constitution which includes check elements 14A and 14B for measuring the characteristics of internal circuits in a plurality of semiconductor chips 11A and 11B, obtained by defining a semiconductor wafer by scribe lines 12, measurement pads 15A and 15B provided within the semiconductor chips 11A and 11B, independently of the internal circuits to be electrically connected to the check elements 14A and 14B, and wiring lines 16A and 16B for electrically connecting the check elements 14A and 14B and measurement pads 15A and 15B. The wiring lines 16A and 16B are at least partly extended to the scribe lines 12.
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