| 摘要 |
PROBLEM TO BE SOLVED: To avoid soldering failures due to solder repelling, etc., during solder plating from bare iron of a base material of a lead frame for semiconductor devices, etc., on the cross section of cut faces of tie bars. SOLUTION: The lead frame 1 for semiconductor devices has tie bars 3 tying leads 2, 2'. The tie bars 3 are offset so that two or more tying parts 4 of the tie bars 3 may not exist on one plane section of each lead. |
