| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for isolating at least one electrical or electronic element integrated on a semiconductor substrate. SOLUTION: In order to isolate at least one electrical or electronic element (16 and 58), such as an interconnecting part integrated on a semiconductor substrate (12), the device has an assembly which has at least one isolating means which is selected from among isolating layers (84, 86 and 90), extending inside the substrate and at least two layered conductors (60, 62 and 64, and 66, 68 and 70), whose height exceeds that of the element and which are integrated inside the substrate and extend along the element on both sides of the element. |
