| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve reliabilities of the electrical connections and the bonding strength of a semiconductor chip to a film board, when mounting the former on the latter using pressing bonding method, using a bonding agent. SOLUTION: Each thin film 27 is formed on the surface of each first connection electrode 23 formed on a relaying board 21, comprising a film board. In this case, each thin film 27 is made of a melting-point metal (tin, etc.), lower than the one of each first connection electrode 23 and the one of each bump electrode 32 of a semiconductor chip 31. Also, the melting-point of each thin film 27 is set lower than the hardening-temperature of a thermosetting bonding agent 28. When merely mounting the semiconductor chip 31 on the relaying board 21 via the bonding agent 28 and holding them to each other at a temperature of hardening thereat the bonding agent 28 and under a prescribed pressure, each thin film 27 is melted and penetrates into the inside of the fine cavities present in the rear surface of each bump electrode 32, and thereafter the bonding agent 28 is hardened.</p> |
