| 摘要 |
PROBLEM TO BE SOLVED: To reduce leakage current between copper traces sandwiching an interlayer insulation film, while maintaining a low permittivity when the interlayer insulation film, composed of multiple layers of insulation films exhibiting low permittivity is formed between the copper traces. SOLUTION: With respect to the method for forming the interlayer insulation film exhibiting low permittivity on a substrate 21 on the surface of which a copper trace 23 is exposed, the interlayer insulation film, composed of multiple layers of insulation films 24, 25 and 29 and the insulation film 24 of the multiple layers of insulation films 24, 25 and 29 which is adjacent to the copper trace 23, is formed by turning a film forming gas consisting of an alkyl compound, having a siloxane bond and either of nitrogen (N2) or ammonia (NH3) into a plasma and causing reaction.
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